Transcend TS2GAP1066S Memory Module Computer Component

Transcend's DDR3-1066 DIMMs are made of high-quality 128Mx8 DDR3 DRAM chips and use robust PCBs that meet JEDEC (the Joint Electron Device Engineering Council) standards. Each chip is selected with the strictest quality and performance standards and is manufactured using small Fine-Pitch Ball Grid Array (FBGA) packages with extra contacts to assure better thermal dissipation, electrical efficiency and reliable computing quality at high clock frequencies. In addition, DDR3 memory modules incorporate all-new "Fly-by" architecture that provides more efficient direct communication between the controller and each DRAM chip. This new architecture also includes dynamic On-DIMM Termination to minimize signal reflections at higher speeds. DDR3 is the successor to DDR2 memory, and will soon become the industry standard for PC memory modules. Compared to DDR2, it offers faster transfer speeds and better bandwidth with an 8-bit as opposed to 4-bit prefetch buffer, and is a perfect match for modern systems using dual or quad-core processors. Moreover, the operating voltage of DDR3 memory modules has been decreased from 1.8V to 1.5V, thus reducing actual memory power consumption by 20-30% compared to systems with DDR2 memory. Transcend's DDR3-1066 DIMMs are currently available in 1GB and 2GB capacities respectively.