The TS128MSK64V3U-I is a 128M x 64bits DDR3-1333 1Rank SO-DIMM. The TS128MSK64V3U-I consists of
8pcs 128Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit
board. The TS128MSK64V3U-I is a Dual In-Line Memory Module and is intended for mounting into 204-pin edge connector sockets.
Synchronous design allows precise cycle control with the use of system clock. Data I/O transactions are possible on both edges of DQS. Range of operation frequencies, programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.
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Description
Product Features:
- Notebook 1 GB DDR3 1333 MHz
- 1 x 1 GB
- CAS latency: 9
- 1.5 V
Transcend 1GB DDR3 SO-DIMM memory module 1 x 1 GB 1333 MHz
1GB DDR3 SO-DIMM, 1333 MHz, CL9, 1.5V
Transcend 1GB DDR3 SO-DIMM, 1 GB, 1 x 1 GB, DDR3, 1333 MHz
Transcend 1GB DDR3 SO-DIMM. Component for: Notebook, Internal memory: 1 GB, Memory layout (modules x size): 1 x 1 GB, Internal memory type: DDR3, Memory clock speed: 1333 MHz, CAS latency: 9
Specification
Features
CAS latency
9
Internal memory
1 GB
Memory layout (modules x size)
1 x 1 GB
Internal memory type
DDR3
Memory clock speed
1333 MHz
Component for
Notebook
Memory voltage
1.5 V
Module configuration
128M x 8
Certification
RoHS
Operational conditions
Operating temperature (T-T)
-40 - 85 °C
Packaging data
Package type
SO-DIMM