Name: Supermicro MBD-X11SDW-8C-TP13F System on Chip BGA 2518 WIO
Brand: Supermicro
SKU: MBD-X11SDW-8C-TP13F-O
Price: 2359.2 GBP

Supermicro

Supermicro MBD-X11SDW-8C-TP13F-O Motherboard Computer Component

MBD-X11SDW-8C-TP13F

The manufacturer that produced the processor.

Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.

A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.

The quantity of processor cores which can be used in the device.

Types of memory which can be used with the product.

The voltage (V) of the memory in the device.

ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.

Memory clock speed is the time it takes for a computer to complete basic operations. It refers to the computer's processing speed and is measured in hertz. It is however not such a reliable measure of a computer's speed as it doesn't take into account other factors like RAM and cache size.

The maximum internal memory which is available in the product.

The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.

RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.

"Graphic adapter" is the hardware that produces images on a display. "On-board" means that the graphics adapter is intergrated inside the motherboard.

The end of a cable with a USB 2.0 connector. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), in addition to the "USB 1.x Full Speed" signaling rate of 12 Mbit/s. USB 2.0 connectors are usually colored black.

Serial ATA (Advanced Technology Attachment) (SATA) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives and optical drives. SATA III (revision 3.x) interface, formally known as SATA 6Gb/s, is a third generation SATA interface running at 6.0Gb/s. The bandwidth throughput, which is supported by the interface, is up to 600MB/s. This interface is backwards compatible with SATA 3 Gb/s interface.

Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device.  Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.

Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.

An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.

The chipset connects the microprocessor to the rest of the motherboard.

What this product is used as a part of (component for).

Design of the motherboard (ATX, BTX etc).

The BIOS (Basic Input/Output System) initializes and tests system hardware components, and loads a bootloader or an operating system from a mass memory device. The BIOS additionally provides abstraction layer for the hardware, i.e. a consistent way for application programs and operating systems to interact with the keyboard, display, and other input/output devices. There are several types of BIOS, including the  motherboard ROM BIOS, video BIOS, drive controller BIOS, network adapter BIOS, and SCSI adapter BIOS.

The minimum and maximum temperatures at which the product can be safely stored.

The minimum and maximum temperatures at which the product can be safely operated.

The measurement or extent of something from side to side.

The distance from the front to the back of something.

The number of places where DIMMs can be connected. A DIMM or dual in-line memory module comprises a series of dynamic random-access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share.

The quantity of processors which can be used by the product.

Supermicro MBD-X11SDW-8C-TP13F. Processor manufacturer: Intel, Processor socket: BGA 2518, Compatible processor series: Intel® Xeon®. Supported memory types: DDR4-SDRAM, Maximum internal memory: 512 GB, Memory voltage: 1.2 V. Supported storage drive interfaces: SATA III, RAID levels: 0, 1, 5, 10. On-board graphics card model: Aspeed AST2500. Ethernet interface type: 10 Gigabit Ethernet, Gigabit Ethernet

Supermicro MBD-X11SDW-8C-TP13F, Intel, BGA 2518, Intel® Xeon®, DDR4-SDRAM, 512 GB, 1.2 V

Supermicro MBD-X11SDW-8C-TP13F-O Motherboard Computer Component

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Description

Product Features:

Supermicro MBD-X11SDW-8C-TP13F System on Chip BGA 2518 WIO

Specification

Processor

Memory

Storage controllers

Graphics

Internal I/O

Rear panel I/O ports

Network

Features

BIOS

Operational conditions

Weight & dimensions

Other features

Media