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Description
Product Features:
- DDR4 functionality and operations supported as defined in the component data sheet
- Features and specifications supported in the Micron DDR4 SODIMM Core data sheet
- Fast data transfer rates: PC4-3200 or PC4-2666
- 32GB (4 Gig x 72)
- Data bus inversion (DBI) for data bus
- Dual-rank
- On-board I 2 C temperature sensor with integrated serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Laptop 32 GB DDR4 3200 MHz
- 260-pin SO-DIMM 1 x 32 GB
- CAS latency: 22
- 1.2 V
- ECC
Micron MTA18ASF4G72HZ-3G2B1 memory module 32 GB 1 x 32 GB DDR4 3200 MHz ECC
32GB (x72, ECC DR), 260-Pin, DDR4, SODIMM
Micron MTA18ASF4G72HZ-3G2B1, 32 GB, 1 x 32 GB, DDR4, 3200 MHz, 260-pin SO-DIMM
Micron MTA18ASF4G72HZ-3G2B1. Component for: Laptop, Internal memory: 32 GB, Memory layout (modules x size): 1 x 32 GB, Internal memory type: DDR4, Memory clock speed: 3200 MHz, Memory form factor: 260-pin SO-DIMM, CAS latency: 22, ECC
Specification
Features
CAS latency
22
Internal memory
32 GB
Memory layout (modules x size)
1 x 32 GB
Internal memory type
DDR4
Memory clock speed
3200 MHz
Component for
Laptop
Memory form factor
260-pin SO-DIMM
ECC
Memory ranking
2
Memory voltage
1.2 V
Module configuration
4096M x 72
Lead plating
Gold
Certification
REACH
Operational conditions
Operating temperature (T-T)
0 - 95 °C
Sustainability
Sustainability certificates
RoHS
Weight & dimensions
Width
69.6 mm
Depth
3.7 mm
Height
30 mm