Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits
Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
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Description
Product Features:
- Intel® Core™ i5 3.1 GHz
- 6 MB L3 LGA 1155 (Socket H2)
- Processor cores: 4 32 nm 64-bit 95 W
- Maximum internal memory supported by processor: 32 GB
Intel Core i5-2380P processor 3.1 GHz 6 MB L3
Core™ i5-2380P Processor (6M Cache, up to 3.40 GHz)
Intel Core i5-2380P, Intel® Core™ i5, LGA 1155 (Socket H2), 32 nm, Intel, 3.1 GHz, 64-bit
Intel Core i5-2380P. Processor family: Intel® Core™ i5, Processor socket: LGA 1155 (Socket H2), Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 32 GB, Memory clock speeds supported by processor: 1066,1333 MHz. Market segment: Desktop. L1 cache: 0.128 MB
Specification
Processor
Processor manufacturer
Intel
Processor generation
2nd gen Intel® Core™ i5
Processor base frequency
3.1 GHz
Processor family
Intel® Core™ i5
Processor cores
4
Processor socket
LGA 1155 (Socket H2)
Component for
PC
Processor lithography
32 nm
Processor threads
4
System bus rate
5 GT/s
Processor operating modes
64-bit
Processor boost frequency
3.4 GHz
Processor cache
6 MB
Processor cache type
L3
Thermal Design Power (TDP)
95 W
Box
No
Stepping
D2
CPU multiplier (bus/core ratio)
31
Memory bandwidth supported by processor (max)
21 GB/s
Memory
Maximum internal memory supported by processor
32 GB
Memory clock speeds supported by processor
1066,1333 MHz
Memory channels
Dual-channel
ECC
No
Graphics
On-board graphics card
No
Features
Idle States
Yes
Thermal Monitoring Technologies
Yes
Market segment
Desktop
Processor special features
Intel® Turbo Boost Technology
2.0
Intel Fast Memory Access
Yes
Intel Flex Memory Access
Yes
Intel® AES New Instructions (Intel® AES-NI)
Yes
Enhanced Intel SpeedStep Technology
Yes
Operational conditions
Maximum operating temperature
72.6 °C
Other features
Intel® Virtualization Technology (Intel® VT)
Yes
L1 cache
0.128 MB