Dual-Core Intel® Xeon® processor 3100 series is available for those applications which are not able to take advantage of more than two processing cores. Of course it includes the industry leading performance and performance per watt of the Intel Core microarchitecture.
Intel E3110, Intel® Xeon®, LGA 775 (Socket T), 45 nm, Intel, E3110, 3 GHz
Intel E3110. Processor family: Intel® Xeon®, Processor socket: LGA 775 (Socket T), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 410 M, Processing Die size: 107 mm². Package width: 157 mm, Package depth: 414 mm, Package height: 148 mm. Processor package size: 37.5 x 37.5 mm. Images Type Map: <div><img src="https://ark.intel.com/inc/images/diagrams/diagram-5.gif" title="Block Diagram"...