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Intel BX805565130P Processor Computer Component

Product Name: 5130

Product Family: Xeon

Brand:Intel

Part Number (MPN): BX805565130P

Categories: Processors

CPIN:81720

£87.12
Per unit, single order
Ordering multiple units? Get a custom quote.

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Description

Product Features:

  • Intel® Xeon® 5130 2 GHz
  • 4 MB L2 LGA 771 (Socket J)
  • Processor cores: 2 65 nm 65 W
  • Box

Intel Xeon 5130 processor 2 GHz 4 MB L2 Box

Xeon Processor 5130 (4M Cache, 2.00 GHz, 1333 MHz FSB)

Performance. Efficiency. Agility.

The
Dual-Core Intel® Xeon® processor 5100 series
, Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing.

The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel® Xeon® processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors.

The Dual-Core Intel Xeon processor 5100 series is compatible with Intel® 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express* and the option of Intel I/O Acceleration Technology.

Dual-core processing
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.

Intel® Core™ microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.

Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.

Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.

4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.

1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.

Intel® Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.

Intel® Extended Memory 64 Technology (Intel® EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.

Enhanced Intel® Speedstep™ Technology
Helps reduce average system power consumption and potentially improves system acoustics.

Intel Xeon 5130, Intel® Xeon®, LGA 771 (Socket J), 65 nm, Intel, 2 GHz, Server/workstation

Intel Xeon 5130. Processor family: Intel® Xeon®, Processor socket: LGA 771 (Socket J), Processor lithography: 65 nm. Market segment: Server. Package width: 157 mm, Package depth: 387 mm, Package height: 173 mm

Specification

Processor

Processor manufacturer
Intel
Processor model
5130
Processor base frequency
2 GHz
Processor family
Intel® Xeon®
Processor cores
2
Processor socket
LGA 771 (Socket J)
Component for
Server/workstation
Processor lithography
65 nm
Processor cache
4 MB
Processor cache type
L2
Processor front side bus
1333 MHz
Thermal Design Power (TDP)
65 W
Box
Yes
Processor ARK ID
27216

Features

Market segment
Server

Packaging data

Package width
157 mm
Package depth
387 mm
Package height
173 mm

Media