Introducing the boxed Intel® Celeron® D processor with 256KB L2 cache and 533 MHz front-side bus in the new LGA 775 package manufactured on Intel's industry-leading 90nm process technology. Combined with the new Intel® 910GL Chipset† this new Intel® desktop platform brings Intel's advancements in integrated video and audio to the value-minded PC buyer.
The boxed Celeron D processor in the LGA775 package features a thermal solution designed by Intel to provide an effective cooling solution that matches the processor. The thermal solution includes a 4 pin connector for fan speed control to help minimize the acoustic noise levels .The acoustic benefits of the 4-pin header are reliant on a properly designed motherboard. Boxed Intel® Desktop boards based on Intel® 925X, 915 and 910 Express Chipsets were designed with support for acoustic benefits of the 4-pin header.
For Celeron D processors based platforms in the LGA775 package a Thermally Advantaged Chassis (TAC) based on TAC version 1.1 is highly recommended to assist in maintaining a required internal chassis temperature.
