Designed for industry-leading performance and maximum energy efficiency, these versatile 1-way and 2-way 64-bit multi-core servers and workstations are ideally suited to a wide range of infrastructure, cloud, high-density, and high performance computing (HPC) applications.
Intel Xeon X5570, Intel® Xeon® 5000 Sequence, LGA 1366 (Socket B), 45 nm, Intel, X5570, 2.93 GHz
Intel Xeon X5570. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 1366 (Socket B), Processor lithography: 45 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 144 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Number of Processing Die Transistors: 731 M, Processing Die size: 263 mm². Package type: Retail box. Processor package size: 42.5mm x 45mm