Performance. Efficiency. Agility.
Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing.
The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel® Xeon® processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors.
The Dual-Core Intel Xeon processor 5100 series is compatible with Intel® 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express* and the option of Intel I/O Acceleration Technology.
Dual-core processing
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.
Intel® Core™ microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.
Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.
Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.
4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.
1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.
Intel® Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.
Intel® Extended Memory 64 Technology (Intel® EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.
Enhanced Intel® Speedstep™ Technology
Helps reduce average system power consumption and potentially improves system acoustics.
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Description
Product Features:
- Intel® Xeon® X5450 3 GHz
- 12 MB L2 LGA 771 (Socket J)
- Processor cores: 4 45 nm 64-bit 120 W
Intel Xeon X5450 processor 3 GHz 12 MB L2
Intel® Xeon® Processor X5450 <br />(12M Cache, 3.00 GHz, 1333 MHz FSB)
Intel Xeon X5450, Intel® Xeon®, LGA 771 (Socket J), 45 nm, Intel, X5450, 3 GHz
Intel Xeon X5450. Processor family: Intel® Xeon®, Processor socket: LGA 771 (Socket J), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 820 M, Processing Die size: 214 mm². Package type: Retail box. Processor package size: 37.5 x 37.5 mm. Intel® Virtualization Technology (Intel® VT): VT-x, Cache memory: 12 MB
Specification
Processor
Processor manufacturer
Intel
Processor model
X5450
Processor base frequency
3 GHz
Processor family
Intel® Xeon®
Processor cores
4
Processor socket
LGA 771 (Socket J)
Component for
Server/workstation
Processor lithography
45 nm
Processor series
Intel Xeon 5400 Series
Processor threads
4
Processor operating modes
64-bit
Processor cache
12 MB
Processor cache type
L2
L2 cache speed
3 GHz
Processor front side bus
1333 MHz
Thermal Design Power (TDP)
120 W
Box
No
Cooler included
No
VID Voltage Range
0.85 - 1.35 V
Stepping
E0
FSB Parity
Yes
Bus type
FSB
CPU multiplier (bus/core ratio)
9
Processor codename
Harpertown
Processor code
SLBBE
Processor ARK ID
34446
Graphics
On-board graphics card
No
Features
Execute Disable Bit
Yes
Idle States
Yes
Thermal Monitoring Technologies
Yes
Market segment
Server
Number of Processing Die Transistors
820 M
Processing Die size
214 mm²
Number of Graphics & IMC Die Transistors
820 M
Embedded options available
No
Export Control Classification Number (ECCN)
3A991.A.1
Commodity Classification Automated Tracking System (CCATS)
NA
Images Type Map
<div><img src="https://ark.intel.com/inc/images/diagrams/diagram-5.gif" title="Block Diagram" /><img src="https://ark.intel.com/inc/images/diagrams/diagram-6.gif" title="Block Diagram" /></div>
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
No
Intel® Turbo Boost Technology
No
Enhanced Intel SpeedStep Technology
Yes
Intel Trusted Execution Technology
No
Intel Enhanced Halt State
Yes
Intel VT-x with Extended Page Tables (EPT)
No
Intel Demand Based Switching
Yes
Intel 64
Yes
Intel Virtualization Technology (VT-x)
Yes
Operational conditions
Tcase
63 °C
Technical details
Born on date
Q4'07
Bus bandwidth
1333
Bus type units
MHz
Launch date
Q4'07
Processor cache
12288 KB
Processor core voltage
0.850-1.3500 V
Product name
Intel Xeon X5450 (12M Cache, 3.00 GHz, 1333 MHz FSB)
Product type
Processor
Status
Discontinued
Processor brand name
Intel Xeon
Last change
63903513
Product family
Intel Xeon Processor 5000 Sequence
Bus speed
1333 MHz
Logistics data
Harmonized System (HS) code
8542310001
Packaging data
Package type
Retail box
Weight & dimensions
Processor package size
37.5 x 37.5 mm
Other features
Intel® Virtualization Technology (Intel® VT)
VT-x
Supplemental SKU
No
Cache memory
12 MB