Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Intel® Demand Based Switching
Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.
Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
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Description
Product Features:
- Intel® Xeon® E7450 2.4 GHz
- 12 MB L3 Socket 604 (mPGA604)
- Processor cores: 6 45 nm 64-bit 90 W
Intel Xeon E7450 processor 2.4 GHz 12 MB L3
Xeon Processor E7450 12M Cache, 2.40 GHz, 1066 MHz FSB
Intel Xeon E7450, Intel® Xeon®, Socket 604 (mPGA604), 45 nm, Intel, E7450, 2.4 GHz
Intel Xeon E7450. Processor family: Intel® Xeon®, Processor socket: Socket 604 (mPGA604), Processor lithography: 45 nm. Market segment: Server, Processing Die size: 503 mm², Number of Graphics & IMC Die Transistors: 1900 M. Processor package size: 53.3 x 53.3 mm
Specification
Processor
Processor manufacturer
Intel
Processor model
E7450
Processor base frequency
2.4 GHz
Processor family
Intel® Xeon®
Processor cores
6
Processor socket
Socket 604 (mPGA604)
Component for
Server/workstation
Processor lithography
45 nm
Processor threads
6
Processor operating modes
64-bit
Processor cache
12 MB
Processor cache type
L3
Processor front side bus
1066 MHz
Thermal Design Power (TDP)
90 W
VID Voltage Range
0.9 - 1.45 V
Graphics
On-board graphics card
No
Features
Execute Disable Bit
Yes
Idle States
No
Market segment
Server
Processing Die size
503 mm²
Number of Graphics & IMC Die Transistors
1900 M
Embedded options available
No
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
No
Intel® Turbo Boost Technology
No
Enhanced Intel SpeedStep Technology
Yes
Intel Trusted Execution Technology
No
Intel Demand Based Switching
Yes
Intel 64
Yes
Intel Virtualization Technology (VT-x)
Yes
Operational conditions
Tcase
68 °C
Weight & dimensions
Processor package size
53.3 x 53.3 mm