Stay ahead of the curve with next-gen DDR4 SODIMM.
Get your notebook or small-form-factor machine fully equipped with HyperX® Impact DDR4 SODIMM and minimise system lag. XMP-ready in capacities of up to 64GB, Plug n Play HyperX Impact DDR4 automatically overclocks to the highest frequency published, up to 3200MHz1, to support Intel and AMD’s latest CPU technologies. Slot in the sleek black PCB for a hassle-free boost, no need to tinker with the BIOS. Upgrade your system’s performance and still run coolly, quietly and efficiently, thanks to HyperX Impact DDR4’s low 1.2 voltage.
1.HyperX DDR4 PnP memory will run in most DDR4 systems up to the speed allowed by the manufacturer's system BIOS. PnP cannot increase the system memory speed faster than is allowed by the manufacturer's BIOS. Memory overclocking is locked at 2133MHz (Skylake) or 2400MHz (Kaby Lake) on all mobile processors except H Series Core i7 processors (i7-xxxxHQ or i7-xxxxHK).
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Description
Product Features:
- Optimised for the latest Intel and AMD CPUs
- Powerful SODIMM performance
- Uses Plug N Play automatic overclocking functionality
- Intel XMP-ready profiles make setup simple
- Laptop 16 GB DDR4 3200 MHz
- 260-pin SO-DIMM 2 x 8 GB
- CAS latency: 20
- 1.2 V
- Intel Extreme Memory Profile (XMP)
Warranty: Lifetime
HyperX Impact HX432S20IB2K2/16 memory module 16 GB 2 x 8 GB DDR4 3200 MHz
16GB Kit (2 x 8GB), DDR4, 3200 MHz, CL20
HyperX Impact HX432S20IB2K2/16, 16 GB, 2 x 8 GB, DDR4, 3200 MHz, 260-pin SO-DIMM, Black
HyperX Impact HX432S20IB2K2/16. Component for: Laptop, Internal memory: 16 GB, Memory layout (modules x size): 2 x 8 GB, Internal memory type: DDR4, Memory clock speed: 3200 MHz, Memory form factor: 260-pin SO-DIMM, CAS latency: 20, Product colour: Black
Specification
Features
CAS latency
20
Internal memory
16 GB
Memory layout (modules x size)
2 x 8 GB
Internal memory type
DDR4
Memory clock speed
3200 MHz
Component for
Laptop
Memory form factor
260-pin SO-DIMM
ECC
No
Memory voltage
1.2 V
Intel Extreme Memory Profile (XMP)
Yes
Product colour
Black
Lead plating
Gold
Windows operating systems supported
Yes
Mac operating systems supported
Yes
Linux operating systems supported
Yes
Operational conditions
Operating temperature (T-T)
0 - 85 °C
Storage temperature (T-T)
-55 - 100 °C
Weight & dimensions
Weight
15.2 g
Packaging data
Package width
312.4 mm
Package depth
95.5 mm
Package height
54.1 mm
Package weight
40.3 g
Package type
Tray
Logistics data
Master (outer) cases per pallet
18 pc(s)
Products per pallet
3600 pc(s)
Master (outer) case width
311.1 mm
Master (outer) case length
203.2 mm
Master (outer) case height
101.6 mm
Harmonized System (HS) code
84733020
Master (outer) case gross weight
1.2 kg
Products per master (outer) case
25 pc(s)
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