Stay ahead of the curve with powerful DDR4 SODIMM.
Get your notebook or small form factor machine fully equipped with HyperX® Impact DDR4 SODIMM and minimize system lag. Ready for AMD Ryzen and Intel XMP-ready in capacities up to 64GB, Plug N Play HyperX Impact DDR4 automatically overclocks to the highest frequency published, up to 3200MHz*, to support Intel and AMD’s latest CPU technologies. Slot in the sleek black PCB for a hassle-free boost, no need to tinker with the BIOS. Upgrade your system’s performance and still run cool, quiet, and efficiently, thanks to HyperX Impact DDR4’s low 1.2 voltage.
* HyperX Plug N Play memory will run in DDR4 systems up to the speed allowed by the manufacturer’s system BIOS. PnP cannot increase the system memory speed faster than is allowed by the manufacturer’s BIOS. HyperX Plug N Play DDR4 products support XMP 2.0 specifications so overclocking can also be achieved by enabling the built-in XMP Profile.
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Description
Product Features:
- Powerful SODIMM Performance
- Plug N Play Automatic Overclocking Functionality
- Intel XMP-Ready Profiles
- Ready for AMD Ryzen
- Higher Performance with Low Power Consumption
- Slim form, sleek design
- Laptop 32 GB DDR4 2666 MHz
- 260-pin SO-DIMM 2 x 16 GB
- CAS latency: 15
- 1.2 V
- Intel Extreme Memory Profile (XMP) 2.0
Warranty: Lifetime
HyperX Impact HX426S15IB2K2/32 memory module 32 GB 2 x 16 GB DDR4 2666 MHz
2 x 16GB, DDR4-2666, CL15, 260-Pin, SODIMM
HyperX Impact HX426S15IB2K2/32, 32 GB, 2 x 16 GB, DDR4, 2666 MHz, 260-pin SO-DIMM
HyperX Impact HX426S15IB2K2/32. Component for: Laptop, Internal memory: 32 GB, Memory layout (modules x size): 2 x 16 GB, Internal memory type: DDR4, Memory clock speed: 2666 MHz, Memory form factor: 260-pin SO-DIMM, CAS latency: 15
Specification
Features
Buffered memory type
Unregistered (unbuffered)
CAS latency
15
Internal memory
32 GB
Memory layout (modules x size)
2 x 16 GB
Internal memory type
DDR4
Memory clock speed
2666 MHz
Component for
Laptop
Memory form factor
260-pin SO-DIMM
Memory ranking
2
Memory voltage
1.2 V
Module configuration
2048M x 64
Row cycle time
45 ns
Refresh row cycle time
350 ns
Row active time
26.25 ns
Intel Extreme Memory Profile (XMP)
Yes
Intel Extreme Memory Profile (XMP) version
2.0
Programming power voltage (VPP)
2.5 V
Country of origin
China
JEDEC standard
Yes
Operational conditions
Operating temperature (T-T)
0 - 85 °C
Storage temperature (T-T)
-55 - 100 °C
Weight & dimensions
Width
69.6 mm
Height
30 mm
Weight
15.2 g
Packaging data
Package width
95.5 mm
Package depth
13.9 mm
Package height
54.1 mm
Package weight
40.3 g
Logistics data
Master (outer) case width
101.6 mm
Master (outer) case length
311.1 mm
Master (outer) case height
203.2 mm
Master (outer) case gross weight
1.2 kg
Products per master (outer) case
25 pc(s)
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