For support call us at
+442037470227
Item Overview
Delivery Options
Return & Warranty
Reviews
Description
Specification
Reviews
Loading...
Description
Product Features:
- Intel® Xeon® 5000 Sequence E5630 2.53 GHz
- 12 MB L3 Socket B (LGA 1366)
- Processor cores: 4 32 nm 64-bit 80 W
- Maximum internal memory supported by processor: 288 GB
HPE E5630 ML/DL370 G6 FIO Kit processor 2.53 GHz 12 MB L3
Intel Xeon Processor E5630 (2.53GHz/4-core/12MB/80W) ML/DL370 G6 FIO Kit
HPE E5630 ML/DL370 G6 FIO Kit, Intel® Xeon® 5000 Sequence, Socket B (LGA 1366), 32 nm, E5630, 2.53 GHz, 64-bit
HPE E5630 ML/DL370 G6 FIO Kit. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: Socket B (LGA 1366), Processor lithography: 32 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 288 GB, Memory clock speeds supported by processor: 800,1066 MHz. Market segment: Server. Temperature (max): 77.6 °C
Specification
Processor
Processor model
E5630
Processor base frequency
2.53 GHz
Processor family
Intel® Xeon® 5000 Sequence
Processor cores
4
Processor socket
Socket B (LGA 1366)
Component for
Server/workstation
Processor lithography
32 nm
Processor threads
8
System bus rate
5.86 GT/s
Processor operating modes
64-bit
Processor boost frequency
2.8 GHz
Processor cache
12 MB
Processor cache type
L3
Thermal Design Power (TDP)
80 W
Box
No
VID Voltage Range
0.750 - 1.350 V
CPU multiplier (bus/core ratio)
19
Memory bandwidth supported by processor (max)
25.6 GB/s
Memory
Maximum internal memory supported by processor
288 GB
Memory clock speeds supported by processor
800,1066 MHz
Memory channels
Triple-channel
ECC
Yes
Features
Market segment
Server
Other features
Temperature (max)
77.6 °C