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HPE 595166-001 Server Computer

Product Name: 370 G6

Product Family: ProLiant

Brand:HPE

Product Series: DL

Part Number (MPN): 595166-001

GTIN (EAN/UPC): 0884962674536

Categories: Servers

CPIN:480228

£2,385.3
Per unit, single order
Ordering multiple units? Get a custom quote.

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Description

Product Features:

  • Intel® Xeon® 5000 Sequence X5650 2.66 GHz
  • 12 GB 1333 MHz DDR3-SDRAM 6 x 2
  • DVD-ROM
  • Rack (4U) 750 W

Warranty: Service & support options: HP Care Pack services include coverage for the HP branded hardware options qualified for the server and purchased at the same time or afterward that are internal to the enclosure. This also includes the 22

HPE ProLiant 370 G6 server Rack (4U) Intel® Xeon® 5000 Sequence X5650 2.66 GHz 12 GB DDR3-SDRAM 750 W

2x Intel Xeon X5650 (2.66GHz, 12MB L3), 12GB DDR3, SATA DVD-ROM, Smart Array P410i/1GB FBWC, 2x 750W

The new HP ProLiant DL370 G6 provides dual-processor compute power in a convenient, 4U rack optimized chassis designed for businesses who want enterprise class features and performance. The HP ProLiant DL370 G6 has been optimized for virtualization and consolidation environments, it is well-suited for deployment in growing businesses, remote office sites, or datacenters.

Features

- Manage Seamlessly From Anywhere, Anytime: Industry leading management solutions enable continuous access from anywhere; The new HP ProLiant Onboard Administrator (powered by the HP Integrated Lights-Out 2 management processor) and the HP Systems Insight Manager allow you to manage the HP ProLiant DL370 G6 seamlessly, from anywhere, anytime; Configuration is quick and consistent with the HP ProLiant portfolio of deployment tools, such as SmartStart, Pre-Boot Execution Environment (PXE), Array Configuration Utility (ACU), and ROM-Based Setup Utility (RBSU)
- Optimize System Performance and Ease of Serviceability: Engineered to optimize system performance and ease of serviceability, the HP ProLiant DL370 G6 provides best-in-class performance in a 2-way expansion server; Intel® Xeon® 5500 series processors offer higher performance, better power efficiency, and more adaptability with Intel QuickPath, Integrated Memory Controller, Turbo Boost, and Intelligent Power Technologies; Up to 144GB Registered Memory DIMMS (up to 24GB Unbuffered). Memory intensive applications benefit from higher memory footprint (18 DIMM slots), Advanced ECC, mirroring, and 4-way interleaving; Nine (9) available PCI-Express Gen2 expansion slots provide latest I/O performance; Clean, tool-free, mechanical design enhances reliability and simplifies configuration and maintenance with tool-free, modular components, hot plug redundancy features for fast maintenance, and minimal cables for easy access to components.
- Maximum expandability and flexibility: Expandable storage support of up to 24 small form factor (SFF) or 14 large form factor (LFF) hot-plug drive bays to support Serial-attached SCSI (SAS) and Serial ATA (SATA) drives; Up to 144GB Registered Memory DIMMS (up to 24GB Unbuffered). Memory intensive applications benefit from higher memory footprint (18 DIMM slots), Advanced ECC, and mirroring; Nine (9) available PCI-Express Gen2 expansion slots provide latest I/O performance
- Maximum flexibility: Flexible architecture provides plenty of headroom for growing businesses; The DL370 G6 provides versatility and room for expansion to satisfy a full spectrum of solutions; Intel processors with Extended Memory 64 Technology (EM64T) enable users to migrate from 32-bit to 64-bit operating environments to increase application performance; Mixture of PCI-Express Gen 2 and PCI X I/O slots allow users to choose the expansion card technology; Up to 7.20TB Hot Plug SFF SAS (24 x 300GB) Up to 14 TB Hot Plug LFF SAS (14 x 1TB); A variety of rack and tower models are available. Tower models are fully convertible to rack configurations for additional deployment flexibility.
- Optimize System Performance and Ease of Serviceability: Engineered to optimize system expansion and ease of serviceability, the ProLiant DL370 G6 provides flagship performance in a 2-way expansion server; ProLiant introduces a family of High Efficiency Power Supplies. Delivers highest efficiency and meets Climate Savers Computing Gold, 80PLUS Gold and setting the standards for Energy Star for Servers compliance; The DL370 G6 utilizes the newest technologies for blazing performance; 18 DIMM Slots: Up to 144GB, using PC3-8500R DDR3 Registered (RDIMM) memory; Up to 24GB, using PC3-10600E DDR3 Unbuffered (UDIMM) memory; Improve your capacity up to 3x with Dynamic Power Capping and Insight Power Manager. Reclaim lost data center power and cooling and increase your capacity; Nine PCI-e Gen 2 slots (2x16, 2x8, 5x4); The HP ProLiant DL370 consistently ranks at the top of TPC-C benchmarks for performance and price/performance.

HPE ProLiant 370 G6, 2.66 GHz, X5650, 12 GB, DDR3-SDRAM, 750 W, Rack (4U)

HPE ProLiant 370 G6. Processor family: Intel® Xeon® 5000 Sequence, Processor frequency: 2.66 GHz, Processor model: X5650. Internal memory: 12 GB, Internal memory type: DDR3-SDRAM, Memory layout (slots x size): 6 x 2 GB. HDD size: 2.5", HDD interface: Serial ATA, Serial Attached SCSI (SAS). Ethernet LAN, Cabling technology: 10/100/1000Base-T(X). Optical drive type: DVD-ROM. Power supply: 750 W, Redundant power supply (RPS) support. Chassis type: Rack (4U)

Specification

Processor

Processor manufacturer
Intel
Processor family
Intel® Xeon® 5000 Sequence
Processor model
X5650
Processor frequency
2.66 GHz
Processor boost frequency
3.06 GHz
Processor cores
6
Processor cache
12 MB
Memory channels supported by processor
Triple
Number of processors installed
2
Thermal Design Power (TDP)
95 W
Processor cache type
Smart Cache
System bus rate
6.4 GT/s
Maximum number of SMP processors
2
Processor socket
Socket B (LGA 1366)
Processor lithography
32 nm
Processor threads
12
Processor operating modes
64-bit
Stepping
B1
FSB Parity
No
Bus type
QPI
Number of QPI links
2
Processor codename
Westmere EP
Tcase
81.3 °C
Maximum internal memory supported by processor
288 GB
Memory types supported by processor
DDR3-SDRAM
Memory clock speeds supported by processor
800,1066,1333 MHz
Memory bandwidth supported by processor (max)
32 GB/s
ECC supported by processor
Yes
Execute Disable Bit
Yes
Idle States
Yes
Thermal Monitoring Technologies
No
Processor package size
42.5 X 45 mm
Supported instruction sets
SSE4.2
Processor code
SLBV3
Physical Address Extension (PAE)
40 bit
Embedded options available
No
CPU multiplier (bus/core ratio)
20
Processor system type
DP
Processor series
Intel Xeon 5600 Series
Conflict-Free processor
No

Memory

Internal memory
12 GB
Internal memory type
DDR3-SDRAM
Memory slots
18x DIMM
ECC
Yes
Memory clock speed
1333 MHz
Memory layout (slots x size)
6 x 2 GB
Maximum internal memory
192 GB

Storage

HDD interface
Serial ATA, Serial Attached SCSI (SAS)
HDD size
2.5"
RAID support
Yes
RAID levels
0, 1, 1+0, 5, 5+0, 6
Hot-swap
Yes
Optical drive type
DVD-ROM

Graphics

Maximum graphics card memory
64 MB

Network

Ethernet LAN
Yes
Cabling technology
10/100/1000Base-T(X)

Ports & interfaces

Ethernet LAN (RJ-45) ports
4
USB 2.0 ports quantity
4
Expansion slots
9
PS/2 ports quantity
2
VGA (D-Sub) ports quantity
1
Serial ports quantity
1

Design

Chassis type
Rack (4U)

Software

Operating system installed
No
Compatible operating systems
Microsoft Windows Server Red Hat Enterprise Linux (RHEL) SUSE Linux Enterprise Server (SLES) Oracle Solaris VMware HP Citrix Essentials for XenServer

Processor special features

CPU configuration (max)
2
Intel Rapid Storage Technology
No
Enhanced Intel SpeedStep Technology
Yes
Intel® Wireless Display (Intel® WiDi)
No
Intel Virtualization Technology for Directed I/O (VT-d)
Yes
Intel® Anti-Theft Technology (Intel® AT)
No
Intel® Hyper Threading Technology (Intel® HT Technology)
Yes
Intel® My WiFi Technology (Intel® MWT)
No
Intel® Turbo Boost Technology
1.0
Intel® Quick Sync Video Technology
No
Intel® InTru™ 3D Technology
No
Intel® Clear Video HD Technology (Intel® CVT HD)
No
Intel® Insider™
No
Intel Flex Memory Access
No
Intel® AES New Instructions (Intel® AES-NI)
Yes
Intel Trusted Execution Technology
Yes
Intel Enhanced Halt State
Yes
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel Demand Based Switching
Yes
Intel Clear Video Technology
No
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)
No
Intel 64
Yes
Intel Virtualization Technology (VT-x)
Yes
Intel Dual Display Capable Technology
No
Intel FDI Technology
No
Intel Fast Memory Access
No
Processor ARK ID
47922

Power

Number of power supply units
2
Redundant power supply (RPS) support
Yes
Power supply
750 W

Operational conditions

Operating temperature (T-T)
10 - 35 °C
Storage temperature (T-T)
-30 - 60 °C
Operating relative humidity (H-H)
10 - 90%
Storage relative humidity (H-H)
5 - 95%

Weight & dimensions

Width
466.7 mm
Depth
723.9 mm
Height
219.2 mm
Weight
35 kg

Other features

Acoustic pressure emissions
39 dB
Disk array controller
Smart Array P410i
Graphics card
RN50
Form factor
4U
Size (imperial)
46.7 cm (18.4")
Weight (imperial)
35 kg (77.1 lbs)
Graphics card family
ATI