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Description
Specification
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Description
Product Features:
- Intel® Xeon® 5000 Sequence X5560 2.8 GHz
- 8 MB L3 Socket B (LGA 1366)
- Processor cores: 4 45 nm 64-bit 95 W
- Maximum internal memory supported by processor: 144 GB DDR3-SDRAM
HPE Intel Xeon X5560 processor 2.8 GHz 8 MB L3
Intel Xeon X5560, 8M Cache, 2.80 GHz, 6.40 GT/s Intel QPI
HPE Intel Xeon X5560, Intel® Xeon® 5000 Sequence, Socket B (LGA 1366), 45 nm, X5560, 2.8 GHz, 64-bit
HPE Intel Xeon X5560. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: Socket B (LGA 1366), Processor lithography: 45 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 144 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Number of Processing Die Transistors: 731 M, Processing Die size: 263 mm². Processor package size: 42.5 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x
Specification
Processor
Processor model
X5560
Processor base frequency
2.8 GHz
Processor family
Intel® Xeon® 5000 Sequence
Processor cores
4
Processor socket
Socket B (LGA 1366)
Component for
Server/workstation
Processor lithography
45 nm
Processor threads
8
System bus rate
6.4 GT/s
Processor operating modes
64-bit
Processor boost frequency
3.2 GHz
Processor cache
8 MB
Processor cache type
L3
Thermal Design Power (TDP)
95 W
VID Voltage Range
0.750 - 1.350 V
Bus type
QPI
Number of QPI links
2
Memory
Maximum internal memory supported by processor
144 GB
Memory types supported by processor
DDR3-SDRAM
Memory clock speeds supported by processor
800,1066,1333 MHz
Memory channels
Triple-channel
ECC
Yes
Graphics
On-board graphics card
No
Features
Execute Disable Bit
Yes
Idle States
Yes
Market segment
Server
Number of Processing Die Transistors
731 M
Processing Die size
263 mm²
CPU configuration (max)
2
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
Yes
Intel® Turbo Boost Technology
Yes
Enhanced Intel SpeedStep Technology
Yes
Intel Trusted Execution Technology
No
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel Demand Based Switching
Yes
Intel Virtualization Technology (VT-x)
Yes
Intel Virtualization Technology for Directed I/O (VT-d)
Yes
Operational conditions
Tcase
75 °C
Weight & dimensions
Processor package size
42.5 mm
Other features
Intel® Virtualization Technology (Intel® VT)
VT-d, VT-x