These Intel Xeon processors, with extended lifecycle support,
utilize Intel’s Hafnium-based 45nm Hi-k silicon process technology
to reduce power consumption, increase switching speed,
and significantly increase transistor density over previous 65nm
technology to 820 million transistors.
These 45nm processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms
for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified
communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military
signal and image processing, and telecommunications (wireless and wireline) servers.
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Description
Product Features:
- Intel® Xeon® 5000 Sequence L5240 3 GHz
- 6 MB L2 LGA 771 (Socket J)
- Processor cores: 2 45 nm 64-bit 40 W
HPE Intel Xeon L5240 processor 3 GHz 6 MB L2
Intel Xeon L5240 (6M Cache, 3.00 GHz, 1333 MHz FSB)
HPE Intel Xeon L5240, Intel® Xeon® 5000 Sequence, LGA 771 (Socket J), 45 nm, L5240, 3 GHz, 64-bit
HPE Intel Xeon L5240. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 771 (Socket J), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 410 M, Processing Die size: 107 mm²
Specification
Processor
Processor model
L5240
Processor base frequency
3 GHz
Processor family
Intel® Xeon® 5000 Sequence
Processor cores
2
Processor socket
LGA 771 (Socket J)
Component for
Server/workstation
Processor lithography
45 nm
Processor operating modes
64-bit
Processor cache
6 MB
Processor cache type
L2
Processor front side bus
1333 MHz
Thermal Design Power (TDP)
40 W
VID Voltage Range
0.850 - 1.3500 V
Graphics
On-board graphics card
No
Features
Execute Disable Bit
Yes
Market segment
Server
Number of Processing Die Transistors
410 M
Processing Die size
107 mm²
Operational conditions
Tcase
56 °C