Performance. Efficiency. Agility.
Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing.
The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel® Xeon® processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors.
The Dual-Core Intel Xeon processor 5100 series is compatible with Intel® 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express* and the option of Intel I/O Acceleration Technology.
Dual-core processing
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.
Intel® Core™ microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.
Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.
Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.
4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.
1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.
Intel® Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.
Intel® Extended Memory 64 Technology (Intel® EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.
Enhanced Intel® Speedstep™ Technology
Helps reduce average system power consumption and potentially improves system acoustics.
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Description
Product Features:
- Intel® Xeon® 5000 Sequence X5560 2.8 GHz
- 8 MB L3 Socket B (LGA 1366)
- Processor cores: 4 45 nm 64-bit 95 W
- 144 GB DDR3-SDRAM
HP Intel Xeon X5560 processor 2.8 GHz 8 MB L3
Intel Xeon X5560 (8M Cache, 2.80 GHz, 6.40 GT/s Intel QPI)
HP Intel Xeon X5560, Intel® Xeon® 5000 Sequence, Socket B (LGA 1366), 45 nm, X5560, 2.8 GHz, 64-bit
HP Intel Xeon X5560. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: Socket B (LGA 1366), Processor lithography: 45 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 144 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Number of Processing Die Transistors: 731 M, Processing Die size: 263 mm². Processor package size: 45 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x
Specification
Processor
Processor model
X5560
Processor base frequency
2.8 GHz
Processor family
Intel® Xeon® 5000 Sequence
Processor cores
4
Processor socket
Socket B (LGA 1366)
Component for
Server/workstation
Processor lithography
45 nm
Processor threads
8
System bus rate
6.4 GT/s
Processor operating modes
64-bit
Processor boost frequency
3.2 GHz
Processor cache
8 MB
Processor cache type
L3
L3 cache speed
2.8 GHz
Thermal Design Power (TDP)
95 W
VID Voltage Range
0.75 - 1.35 V
Stepping
D0
Bus type
QPI
CPU multiplier (bus/core ratio)
21
Number of QPI links
2
Memory bandwidth supported by processor (max)
32 GB/s
Memory
Maximum internal memory supported by processor
144 GB
Memory types supported by processor
DDR3-SDRAM
Memory clock speeds supported by processor
800,1066,1333 MHz
Memory channels
Triple-channel
ECC
Graphics
On-board graphics card
Features
Execute Disable Bit
Idle States
Market segment
Server
Number of Processing Die Transistors
731 M
Processing Die size
263 mm²
Physical Address Extension (PAE)
CPU configuration (max)
2
Embedded options available
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
Intel® Turbo Boost Technology
Intel® Smart Cache
Enhanced Intel SpeedStep Technology
Intel VT-x with Extended Page Tables (EPT)
Intel Demand Based Switching
Intel Virtualization Technology (VT-x)
Intel Virtualization Technology for Directed I/O (VT-d)
Operational conditions
Tcase
75 °C
Weight & dimensions
Processor package size
45 mm
Other features
Intel® Virtualization Technology (Intel® VT)
VT-d, VT-x