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HP GX574AA Processor Computer Component

Product Name: Intel Xeon E5450

Brand:HP

Part Number (MPN): GX574AA

GTIN (EAN/UPC): 0883585458240

Categories: Processors

CPIN:195690

End of life date: 08 Apr 2010

£236.8
Per unit, single order
Ordering multiple units? Get a custom quote.

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Description

Product Features:

  • Intel® Xeon® 5000 Sequence E5450 3 GHz
  • 12 MB L2 LGA 771 (Socket J)
  • Processor cores: 4 45 nm 64-bit 80 W

HP Intel Xeon E5450 processor 3 GHz 12 MB L2

Intel Xeon E5450 (3GHz, L2 Cache 12 MB), FSB 1333MHz

The Intel Xeon Processor is based on the Intel® NetBurst™ micro-architecture and includes several performance enhancing features. The Intel Xeon Processor with 512k L2 cache also introduces an exciting feature, called Hyper-Threading Technology. This technology makes more efficient use of the processor resources and can increase performance in multi-threaded, multi-processing aware applications.

The Intel® NetBurst™ micro-architecture and Hyper-Threading Technology enable the Intel Xeon Processor to achieve breakthrough performance for visual computing, concurrent application environments, and the future of the Internet.

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

HP Intel Xeon E5450, Intel® Xeon® 5000 Sequence, LGA 771 (Socket J), 45 nm, E5450, 3 GHz, 64-bit

HP Intel Xeon E5450. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 771 (Socket J), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 820 M, Processing Die size: 214 mm². Weight: 2.04 kg, Processor package size: 37.5 mm. Intel® Virtualization Technology (Intel® VT): VT-x

Specification

Processor

Processor model
E5450
Processor base frequency
3 GHz
Processor family
Intel® Xeon® 5000 Sequence
Processor cores
4
Processor socket
LGA 771 (Socket J)
Component for
Server/workstation
Processor lithography
45 nm
Processor threads
4
Processor operating modes
64-bit
Processor cache
12 MB
Processor cache type
L2
Processor front side bus
1333 MHz
Thermal Design Power (TDP)
80 W
VID Voltage Range
0.85 - 1.35 V
Stepping
E0
FSB Parity
CPU multiplier (bus/core ratio)
9

Graphics

On-board graphics card

Features

Execute Disable Bit
Idle States
Thermal Monitoring Technologies
Market segment
Server
Number of Processing Die Transistors
820 M
Processing Die size
214 mm²

Processor special features

Enhanced Intel SpeedStep Technology
Intel Demand Based Switching
Intel Virtualization Technology (VT-x)

Operational conditions

Tcase
67 °C

Weight & dimensions

Weight
2.04 kg
Processor package size
37.5 mm

Other features

Intel® Virtualization Technology (Intel® VT)
VT-x

Media