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HP EY016AA Processor Computer Component

Product Name: Intel Xeon 5150

Brand:HP

Part Number (MPN): EY016AA

GTIN (EAN/UPC): 0882780507517

Categories: Processors

CPIN:84980

End of life date: 31 Mar 2008

£122.4
Per unit, single order
Ordering multiple units? Get a custom quote.

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Description

Product Features:

  • Intel® Xeon® 5000 Sequence 5150 2.66 GHz
  • 4 MB L2 LGA 771 (Socket J)
  • Processor cores: 2 65 nm 64-bit 65 W

HP Intel Xeon 5150 processor 2.66 GHz 4 MB L2

Intel Xeon 5150 (4M Cache, 2.66 GHz, 1333 MHz FSB), 64-bit, 64nm, LGA771

Performance. Efficiency. Agility.
The Dual-Core Intel® Xeon® processor 5100 series, Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing.

The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel® Xeon® processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors.

The Dual-Core Intel Xeon processor 5100 series is compatible with Intel® 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express* and the option of Intel I/O Acceleration Technology.

Dual-core processing
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.

Intel® Core™ microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.

Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.

Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.

4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.

1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.

Intel® Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.

Intel® Extended Memory 64 Technology (Intel® EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.

Enhanced Intel® Speedstep™ Technology
Helps reduce average system power consumption and potentially improves system acoustics.

HP Intel Xeon 5150, Intel® Xeon® 5000 Sequence, LGA 771 (Socket J), 65 nm, 2.66 GHz, 64-bit, Server/workstation

HP Intel Xeon 5150. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 771 (Socket J), Processor lithography: 65 nm. Market segment: Server, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Weight: 2.05 kg, Processor package size: 37.5 mm. Intel® Virtualization Technology (Intel® VT): VT-x, Dimensions (WxDxH): 37.5 x 37.5 x 3.8 mm, Size (imperial): 3.73 cm (1.47")

Specification

Processor

Processor model
5150
Processor base frequency
2.66 GHz
Processor family
Intel® Xeon® 5000 Sequence
Processor cores
2
Processor socket
LGA 771 (Socket J)
Component for
Server/workstation
Processor lithography
65 nm
Processor threads
2
Processor operating modes
64-bit
Processor cache
4 MB
Processor cache type
L2
Processor front side bus
1333 MHz
Thermal Design Power (TDP)
65 W
VID Voltage Range
1 - 1.5 V
Stepping
B2
FSB Parity
Yes
CPU multiplier (bus/core ratio)
8

Graphics

On-board graphics card
No

Features

Execute Disable Bit
Yes
Idle States
Yes
Thermal Monitoring Technologies
Yes
Market segment
Server
Number of Processing Die Transistors
291 M
Processing Die size
143 mm²

Processor special features

Enhanced Intel SpeedStep Technology
Yes
Intel Trusted Execution Technology
Yes
Intel Demand Based Switching
Yes
Intel Virtualization Technology (VT-x)
Yes

Operational conditions

Tcase
65 °C

Weight & dimensions

Weight
2.05 kg
Processor package size
37.5 mm

Other features

Intel® Virtualization Technology (Intel® VT)
VT-x
Dimensions (WxDxH)
37.5 x 37.5 x 3.8 mm
Size (imperial)
3.73 cm (1.47")

Media