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Description
Product Features:
- Intel® Xeon® 5000 Sequence X5675 3.06 GHz
- 12 MB L3 Socket B (LGA 1366)
- Processor cores: 6 32 nm 64-bit 95 W
- Maximum internal memory supported by processor: 288 GB
HP DL160 G6 X5675 FIO Kit processor 3.06 GHz 12 MB L3
DL160 G6 Intel Xeon X5675 (3.06 GHz/6-core/12MB/95 W) FIO Processor kit
HP DL160 G6 X5675 FIO Kit, Intel® Xeon® 5000 Sequence, Socket B (LGA 1366), 32 nm, X5675, 3.06 GHz, 64-bit
HP DL160 G6 X5675 FIO Kit. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: Socket B (LGA 1366), Processor lithography: 32 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 288 GB, Memory clock speeds supported by processor: 800,1066,1333 MHz. Market segment: Server. Temperature (max): 81.3 °C
Specification
Processor
Processor model
X5675
Processor base frequency
3.06 GHz
Processor family
Intel® Xeon® 5000 Sequence
Processor cores
6
Processor socket
Socket B (LGA 1366)
Component for
Server/workstation
Processor lithography
32 nm
Processor threads
12
System bus rate
6.4 GT/s
Processor operating modes
64-bit
Processor boost frequency
3.46 GHz
Processor cache
12 MB
Processor cache type
L3
Thermal Design Power (TDP)
95 W
Box
No
VID Voltage Range
0.750 - 1.350 V
CPU multiplier (bus/core ratio)
23
Memory bandwidth supported by processor (max)
32 GB/s
Memory
Maximum internal memory supported by processor
288 GB
Memory clock speeds supported by processor
800,1066,1333 MHz
Memory channels
Triple-channel
ECC
Yes
Features
Market segment
Server
Other features
Temperature (max)
81.3 °C