Now featuring Intel’s second-generation quad-core processor, existing mainstream
server platforms, new high-performance computing (HPC) systems, new workstations,
and new business servers each deliver a unique combination of technology targeted at
specific IT use environments. By selecting a platform that is best tuned for the most
common IT usages, Intel® servers are able to better optimize return on investment while
extending the leading performance and performance-per-watt advantages enjoyed
when using Intel’s proven multi-core technology. The Intel® Xeon® processor 5400?
series with quad-core technology helps provide your data center or business with the
performance headroom needed to confidently consolidate applications onto fewer
systems using proven virtualization solutions or the compute power necessary for
high-performance computing applications and workstation solutions.
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Description
Product Features:
- Intel® Xeon® 5000 Sequence X5470 3.33 GHz
- 12 MB L2 LGA 771 (Socket J)
- Processor cores: 4 45 nm 64-bit 120 W
HP Intel Xeon X5470 processor 3.33 GHz 12 MB L2
Intel Xeon X5470 (12M Cache, 3.33 GHz, 1333 MHz FSB)
HP Intel Xeon X5470, Intel® Xeon® 5000 Sequence, LGA 771 (Socket J), 45 nm, X5470, 3.33 GHz, 64-bit
HP Intel Xeon X5470. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 771 (Socket J), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 820 M, Processing Die size: 214 mm². Intel® Virtualization Technology (Intel® VT): VT-x
Specification
Processor
Processor model
X5470
Processor base frequency
3.33 GHz
Processor family
Intel® Xeon® 5000 Sequence
Processor cores
4
Processor socket
LGA 771 (Socket J)
Component for
Server/workstation
Processor lithography
45 nm
Processor operating modes
64-bit
Processor cache
12 MB
Processor cache type
L2
Processor front side bus
1333 MHz
Thermal Design Power (TDP)
120 W
VID Voltage Range
0.850 - 1.3500 V
FSB Parity
Yes
Graphics
On-board graphics card
No
Features
Execute Disable Bit
Yes
Idle States
Yes
Thermal Monitoring Technologies
Yes
Market segment
Server
Number of Processing Die Transistors
820 M
Processing Die size
214 mm²
Processor special features
Enhanced Intel SpeedStep Technology
Yes
Intel Virtualization Technology (VT-x)
Yes
Operational conditions
Tcase
63 °C
Other features
Intel® Virtualization Technology (Intel® VT)
VT-x