Maximize Performance. Minimize Power. Automatically.
As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with standard enterprise servers that deliver more performance and scalability, more efficiently.
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Description
Product Features:
- Intel® Xeon® 3.4 GHz
- 2 MB L2 Socket 604 (mPGA604)
- Processor cores: 1 90 nm 64-bit 110 W
HP Intel Xeon 3.4 GHz processor 2 MB L2
Intel Xeon Processor 3.40E GHz, 2M Cache, 800 MHz FSB
HP Intel Xeon 3.4 GHz, Intel® Xeon®, Socket 604 (mPGA604), 90 nm, 3.4 GHz, 64-bit, Server/workstation
HP Intel Xeon 3.4 GHz. Processor family: Intel® Xeon®, Processor socket: Socket 604 (mPGA604), Processor lithography: 90 nm. Market segment: Server, Number of Processing Die Transistors: 169 M, Processing Die size: 135 mm². Processor package size: 42.5 mm
Specification
Processor
Processor base frequency
3.4 GHz
Processor family
Intel® Xeon®
Processor cores
1
Processor socket
Socket 604 (mPGA604)
Component for
Server/workstation
Processor lithography
90 nm
Processor operating modes
64-bit
Processor cache
2 MB
Processor cache type
L2
Processor front side bus
800 MHz
Thermal Design Power (TDP)
110 W
VID Voltage Range
1.2875 - 1.3875 V
FSB Parity
Yes
Graphics
On-board graphics card
No
Features
Execute Disable Bit
Yes
Idle States
Yes
Market segment
Server
Number of Processing Die Transistors
169 M
Processing Die size
135 mm²
Processor special features
Enhanced Intel SpeedStep Technology
Yes
Operational conditions
Tcase
73 °C
Weight & dimensions
Processor package size
42.5 mm