Maximize Performance. Minimize Power. Automatically.
As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with standard enterprise servers that deliver more performance and scalability, more efficiently.
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Description
Product Features:
- Intel® Xeon® 3.06 GHz
- 0.512 MB L2 Socket 604 (mPGA604)
- Processor cores: 1 130 nm 32-bit 85 W
HP Intel Xeon 3.06 GHz processor 0.512 MB L2
Intel Xeon 3.06 GHz, 512KB Cache, 533 MHz FSB
HP Intel Xeon 3.06 GHz, Intel® Xeon®, Socket 604 (mPGA604), 130 nm, 3.06 GHz, 32-bit, Server/workstation
HP Intel Xeon 3.06 GHz. Processor family: Intel® Xeon®, Processor socket: Socket 604 (mPGA604), Processor lithography: 130 nm. Market segment: Server, Number of Processing Die Transistors: 55 M, Processing Die size: 131 mm². Processor package size: 42.5 mm
Specification
Processor
Processor base frequency
3.06 GHz
Processor family
Intel® Xeon®
Processor cores
1
Processor socket
Socket 604 (mPGA604)
Component for
Server/workstation
Processor lithography
130 nm
Processor operating modes
32-bit
Processor cache
0.512 MB
Processor cache type
L2
Processor front side bus
533 MHz
Thermal Design Power (TDP)
85 W
VID Voltage Range
1.352 - 1.467 V
FSB Parity
Yes
Graphics
On-board graphics card
No
Features
Market segment
Server
Number of Processing Die Transistors
55 M
Processing Die size
131 mm²
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
Yes
Operational conditions
Tcase
73 °C
Weight & dimensions
Processor package size
42.5 mm