B8
Recommend for Intel® Xeon ® Platinum /Gold/Silver/Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Aluminum Stacked Fin Soldered on Copper Base with 4x Heat Pipes Embedded for 2U Server & up Solution, Support CPU Power Up to 205 Watts Heat Dissipation.
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Description
Product Features:
- Processor Heatsink/Radiatior
- Supported processor sockets: LGA 3647 (Socket P)
- Aluminium, Copper
- 1 pc(s)
Dynatron B8 computer cooling system Processor Heatsink/Radiatior Aluminium, Copper 1 pc(s)
B8, Intel Xeon, FCLGA 3647, Passive, Aluminum Stacked Fins, 4x Heat Pipes, 205W, 2U
Dynatron B8, Heatsink/Radiatior, Aluminium, Copper
Dynatron B8. Type: Heatsink/Radiatior. Width: 80 mm, Depth: 108 mm, Height: 64 mm. Product colour: Aluminium, Copper
Specification
Performance
Suitable location
Processor
Type
Heatsink/Radiatior
Supported processor sockets
LGA 3647 (Socket P)
Compatible processor series
Intel® Xeon®
Quantity per pack
1 pc(s)
Design
Product colour
Aluminium, Copper
Material
Aluminium, Copper
Fins material
Aluminium
Number of heat pipes
4
Rack capacity
2U
Power
Thermal Design Power (TDP)
205 W
Weight & dimensions
Width
80 mm
Depth
108 mm
Height
64 mm
Weight
600 g
Fins thickness
0.4 mm
Technical details
Sustainability certificates
RoHS, WEEE
Other features
Thermal grease