B6
Recommend for Intel® Xeon ® Platinum /Gold/Silver/Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Square ILM, Copper stacked fin with vapor chamber for 1U Server Solution, Support CPU power up to 205 Watts heat dissipation.
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Description
Product Features:
- Processor Heatsink/Radiatior
- Supported processor sockets: LGA 3647 (Socket P)
- Copper
- 1 pc(s)
Dynatron B6 computer cooling system Processor Heatsink/Radiatior Copper 1 pc(s)
B6, Intel Xeon, FCLGA 3647, Passive, Copper fins, 205W, 1U
Dynatron B6, Heatsink/Radiatior, Copper
Dynatron B6. Type: Heatsink/Radiatior. Width: 90 mm, Depth: 90 mm, Height: 27 mm. Product colour: Copper
Specification
Performance
Suitable location
Processor
Type
Heatsink/Radiatior
Supported processor sockets
LGA 3647 (Socket P)
Compatible processor series
Intel® Xeon®
Quantity per pack
1 pc(s)
Design
Product colour
Copper
Material
Copper
Fins material
Copper
Rack capacity
1U
Power
Thermal Design Power (TDP)
205 W
Weight & dimensions
Width
90 mm
Depth
90 mm
Height
27 mm
Weight
420 g
Fins thickness
0.3 mm
Technical details
Sustainability certificates
RoHS, WEEE
Other features
Thermal grease