B12
Recommend for Intel® Xeon ® Platinum /Gold/Silver/Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Square ILM, Aluminum Stacked Fin Soldered on Copper Base with 4x Heat Pipes Embedded for 2U server & up solution, Support CPU Power Up to 205 Watts Heat Dissipation.
For support call us at
+442037470227
Item Overview
Delivery Options
Return & Warranty
Reviews
Description
Specification
Media
Reviews
Loading...
Description
Product Features:
- Processor Heatsink/Radiatior
- Supported processor sockets: LGA 3647 (Socket P)
- Aluminium, Copper
- 1 pc(s)
Dynatron B12 computer cooling system Processor Heatsink/Radiatior Aluminium, Copper 1 pc(s)
B12, Intel Xeon, FCLGA 3647, Aluminum Fins, 4x Heat Copper Pipes, 205W, 2U
Dynatron B12, Heatsink/Radiatior, Aluminium, Copper
Dynatron B12. Type: Heatsink/Radiatior. Width: 90 mm, Depth: 90 mm, Height: 64 mm. Product colour: Aluminium, Copper
Specification
Performance
Suitable location
Processor
Type
Heatsink/Radiatior
Supported processor sockets
LGA 3647 (Socket P)
Compatible processor series
Intel® Xeon®
Quantity per pack
1 pc(s)
Design
Product colour
Aluminium, Copper
Material
Aluminium, Copper
Radiator material
Aluminum
Fins material
Aluminium
Number of heat pipes
4
Rack capacity
2U
Power
Thermal Design Power (TDP)
205 W
Weight & dimensions
Width
90 mm
Depth
90 mm
Height
64 mm
Weight
590 g
Fins thickness
0.4 mm
Technical details
Sustainability certificates
RoHS, WEEE
Other features
Thermal grease