Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
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Cooler Master HTK-002-U1-GP Heat Sink Compound Computer Component
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Brand:Cooler Master
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£13.47
Per unit, single order
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Description
Product Features:
- Suitable for CPU, chipsets on Mainboard, VGA card, etc
- Easy to use
- Zif Socket Templates ensure correct applying area with various CPU socket types
- Produces an even layer when using applicator
- Dielectric
- Wide range of application temperature
- Thermal paste 4.5 W/m·K
- 0.8 °C/W 2.37 g/cm³
- White
- 1 pc(s)
Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
0.8 °C/W, 550 volts/mil, 21.7 kV/mm
Cooler Master HTK-002, Thermal paste, 4.5 W/m·K, White, 0.8 °C/W, 2.37 g/cm³, 1 pc(s)
Cooler Master HTK-002. Type: Thermal paste, Thermal conductivity: 4.5 W/m·K, Product colour: White. Quantity per pack: 1 pc(s), Package width: 102 mm, Package depth: 171 mm
Specification
Features
Type
Thermal paste
Thermal conductivity
4.5 W/m·K
Product colour
White
Thermal resistance
0.8 °C/W
Specific gravity
2.37 g/cm³
Packaging data
Quantity per pack
1 pc(s)
Package width
102 mm
Package depth
171 mm
Package height
40 mm